Flexible-rigid PCB capability

2205 2023-04-26 ECO-GO PCB Co,.Limited

Printed Circuit Board (PCB) Circuit Board Electronic Board PCB Manufacturer PCB Assembly PCB Prototype Multilayer PCB Rigid PCB Flexible PCB HDI PCB PCB Design PCB Fabrication PCB Soldering Surface Mount Technology (SMT) Through-Hole Technology (THT)


Items	Parameters
Max Panel Size	10"×20.5"(250mm×520mm)
Min Inner Layer Line Width/Space	3mil/3mil(0.075mm/0.075mm)
Min Inner Layer Pad	3mil(0.075mm)
FPC PI Thickness	1~6MIL
Min Core Thickness	2mil(0.05mm)
Inner Layer Copper Thickness	0.5-1oz
Outer Layer Base Copper Thickness	1/3-4oz
Final Board Thickness	0.3-6.6mm
Final Board Thickness Tolerance	±10%
Layer Count	2-16
Inner Layers Registration	±2mil(±50um)
Min Mechanical Drill Size	0.15mm
Hole Position Accuracy	±2mil(±50um)
Hole Diameter Tolerance	±2mil(±50um)
Max PTH Aspect Ratio	10:01
Image To Image Tolerance	3mil/3mil(75um/75um)
Min Out Layer Line Width/Space	3mil/3mil(75mm/75mm)
Etching Tolerance	10%
Solder Mask Thickness	≥1mil(≥25um)
Min Solder Mask Dam	4mil(100um)
Max Solder Mask Plug Hole Diameter	0.50mm
Surface Treatment	HASL,Gold Finger,Plating Gold,OSP,ENIG,IMM TIN, IMM AG
Max Gold Thickness Of Gold Finger	≤30u"(≤0.75um)
Gold Thickness Of Immersin Gold	1-3u"(0.025-0.07um)
Impedance Control And Tolerance	±10%
Peel Strength	≥61B/in(≥107g/mm)
Warp And Twist	≤0.75%